Thin Film Metallization
MARUWA has implemented manufacturing from the material and metallization processes by combining both technologies which were cultivated in-house for many years. The materials permit the production of sophisticated circuit patterns that meet customers’ needs with high-degree integration and electric properties by using substrates which have excellent thermal conductivity, such as alumina substrates, aluminum nitride substrates, multilayered substrates, or dielectric ceramics.
Metallization Types
![Metallization Types](/e/products/ceramic/upfiles/thin-metallize_01_en.gif)
List of Products
![Thin Film Metallized Substrates](/e/products/ceramic/upfiles/thin-fnd_01_en.jpg)
Applied circuit substrates for optical communication markets, circuit substrates for high frequency markets
Related Information
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Product Information
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List of Characteristic Values