Glazed Substrates
Features
Applications
Thermal print head, Thin film hybrid IC
Glaze Materials and Characteristic Values
Item/Unit | Measurement Equipment | Glaze Material and Substrate Types | |||||
GS-31 | GS-32 | GS-40 | GS-62 | ||||
HA-96-2 | HA-96-2 | HA-96-2 | HA-96-2 | ||||
Color | - | White | White | White | White | ||
Glass Transition Temperature | (°C) | TG-DTA | 688±20 | 697±20 | 750±20 | 692±20 | |
Yield Point | (°C) | TMA | 757±20 | 763±20 | 861±20 | 746±20 | |
Softening Point | (°C) | TG-DTA | 969±20 | 875±20 | 935±20 | - | |
Coefficient of Thermal Expansion | ×10-7/K | TMA | 68±3 | 72±3 | 67±3 | 65±3 | |
Thermal Conductive | 30°C | (W/mK) | Laser Flash Thermal Constants Analyzer | 1.05 | 0.88 | 0.80 | 0.93 |
300°C | (W/mK) | Laser Flash Thermal Constants Analyzer | 1.13 | 1.10 | 1.06 | - | |
600°C | (W/mK) | Laser Flash Thermal Constants Analyzer | 1.51 | 1.76 | 1.47 | - | |
Density | (g/㎤) | - | 2.99 | 3.10 | 3.17 | 3.03 | |
Dielectric Constant | 1MHz | - | 8.6 | - | 9.3 | - | |
1GHz | - | 8.4 | - | 9.0 | - | ||
Volume Resistivity | 20°C | (Ω・㎝) | - | >1014 | >1014 | >1014 | - |
300°C | (Ω・㎝) | - | 1*>1014 | 1*>1014 | 1*>1014 | - | |
500°C | (Ω・㎝) | - | 1*>1010 | 1*>1010 | 1*>1010 | - | |
Specific Heat | (J/g°C) | - | 0.576 | 0.631 | 0.638 | 0.684 | |
Features | Alkali-Free Lead-Free | Alkali-Free Lead-Free | Alkali-Free Lead-Free Ultra Heat Resistance | Alkali-Free Lead-Free | |||
Use | Partial Grazing | Full Grazing | Full Grazing Partial Grazing | Full Grazing |
Glaze Processing
Item/Unit | Type | ||
HA-96-2 | |||
As Fired | (Ra ㎛) | 0.2~0.5 | |
Lapping | (Ra ㎛) | 0.3~1.0 | |
Polishing | (Ra ㎛) | 0.05 or less | |
Tolerance after Grinding | (㎜) | ±0.05 |
Related Information
-
Product Information
- List of Characteristic Values (for Glazed Substrates)